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Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Specification AWT722
SSC
Drawn Ap v al pro
i
Ap v al pro
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Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
CONTENTS
1. Feature & Application 2. Absolute M aximu Ratings m 3. Electr Char ct o a eristic s 4. 5. 7. 8. 9. Optical charact eristics Color & Binnin g Outline Dimension Packing Soldering
6. Rank of AWT7 22
10. P recaution for use
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Z-Power LED X10490 Technical Data Sheet
AWT722
Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40E to 100E . The high reliability feature is crucial to Automotive interior and Indoor ESS.
*
AWT722
Features
White colored SMT package. * Material : InGaN/SiC * Encapsulating Resin : Epoxy Resin * Suitable for all SMT assembly methods ; Suitable for all soldering methods * RoHS Compliant
Applications
* Interior automotive * Office Automation, Electrical Appliances, Industrial Equipment
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Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
2. Absolute maximum ratings
Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage (per die) Operating Temperature Storage Temperature Symbol Pd IF IFM
*2
Value 342 90 100 5 -40 ~ +85 -40 ~ +100
Unit mW mA mA V C C
VR Topr Tstg
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW A 1msec of pulse width and D A 1/10 of duty ratio.
3. Electric & Optical characteristics
Parameter Forward Voltage (per die) Reverse Current (per die) Luminance Intensity Luminance Flux O Color Temperature Color Coordinate Viewing Angle
*2 *1
Symbol VF IR IV
V
Condition
IF =20 mA VR=5V IF =60 mA IF =60 mA IF =60 mA IF =60 mA IF =60 mA IF =60 mA
Min 2.8 2500 0.4129 0.3725 -
Typ 3.2 4600 11 -
Max 3.8 10 3170 0.497 0.4466
Unit V A mcd lm K deg lm/W
CCT X Y 21/2
120 57
-
Optical Efficiency
c
op
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is 3/4 10% *2. 21/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC.
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Forward Voltage VF [V]
Relative Luminosity(a.u.)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
4. Optical characteristics
Forward Current vs. Forward Voltage (per die)
(Ta=25 OC )
3.4
3.2
3.0
2.8
2.6
0
5
10
15
20
25
30
Forward Current IF [mA]
Relative Luminous Intensity vs Forward Current
(Ta=25 OC )
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0
0 15 30 45 60 75 90 105 120
Forward Current IF[mA]
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Forward current IF (mA)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
4. Optical characteristics
Ambient Temperature vs. Allowable Forward Current (per die)
(Ta=25 OC )
35
30
25
20
15
10
5
0
-25 0 25 50
O
75
100
Ambient temperature Ta( C)
Radiation Diagram
0 -30 30
-60
60
-90
90
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Normalized Intensity
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
4. Optical characteristics
Spectrum
(TA=25E , IF=60mA)
1.0
0.8
0.6
0.4
0.2
0.0
350
400
450
500
550
600
650
700
750
800
Wavelength[nm]
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CIE (y)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
5. Color & Binning
0.9 0.8 0.7
505 515 510 520 525 530 535 540 545 550 555 560 500 565 570 575 580 585 590 595 600 610 620 630 830
0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0
495
490 485 480 475 470 460
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
CI E(x)
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y
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
U
0.46
5. Color & Binning
0.44
v2 v
0.42
t2
0.40
v1
2500K
w2
t1
r2 r
0.38
3170K
u2
w1
r1 3800K u1 s2
s1
0.36
4600K
0.34 0.36
COLOR RANK
r1
0.38
0.40
0.42
0.44
0.46
0.48
0.50
x

Y 0.3734 0.3612 0.3823 0.395 Y 0.395 0.3823 0.4 0.4146 Y 0.4146 0.4 0.4137 0.4289 r2 Y 0.385 0.3734 0.395 0.4116 Y 0.4116 0.395 0.4146 0.431 Y 0.431 0.4146 0.4289 0.4466 X 0.361 0.3593 0.3938 0.3988 t2 X 0.3988 0.3938 0.432 0.439 v2 X 0.439 0.432 0.4861 0.497 s1 X 0.356 0.3545 0.382 0.3862 u1 X 0.3862 0.382 0.4129 0.42 w1 X 0.42 0.4129 0.4588 0.467
0.01
X 0.3593 0.3575 0.39 0.3938 t1 X 0.3938 0.39 0.4255 0.432 v2 X 0.432 0.4255 0.477 0.4861
Y 0.351 0.3408 0.358 0.3709 Y 0.3709 0.358 0.3725 0.3869 Y 0.3869 0.3725 0.3838 0.3979
s2 X 0.3575 0.356 0.3862 0.39 u2 X 0.39 0.3862 0.42 0.4255 w2 X 0.4255 0.42 0.467 0.477
Y 0.3612 0.351 0.3709 0.3823 Y 0.3823 0.3709 0.3869 0.4 Y 0.4 0.3869 0.3979 0.4137
* Measurement Uncertainty of the Color Coordinates : 3/4
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Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
A A A
6. Rank of AWT722
Rank Name Table X1 VF X2 IV X3 CIE
Forward Voltage [V] Rank Name Y Z A MIN 2.9 3.1 3.3 MAX 3.1 3.3 3.5
Luminous Intensity [mcd] Rank Name O P MIN 3500 5000 MAX 5000 7200
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Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
7.outline dimension
Package Outlines
6
5
4
Package Marking (Cathode)
1
2
3
Front View
Right View
Rear View
( Tolerance: 3/4 0.2, Unit: mm )
Circuit Diagram
Recommended Solder Pad
Warm White Anode
6 5 4
W1
1
W2
2
W3
3
Warm White Cathode
* MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Epoxy Resin Ag Plating Copper Alloy
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Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
8. packing
Package Marking
( Tolerance: 3/4 0.2, Unit: mm )
1)Quantity : 700pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 3/4 0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
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Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
UR
eel P ack ing S tru ctu re
Reel
RANK:
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
XXX
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR DESI PAK
Aluminum Vinyl Bag
RANK:
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
XXX
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142
1 SIDE RANK:
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX
RoHS
XXX
XXXXXX
b
c
1
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
a
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Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
9. soldering
(1) Lead Solder
Lead Solder
Lead Solder Pre-heat Pre-heat time Peak-Tempera re tu Sold ering time Cond ition 120 150E ~ 120 sec. Max. 240 Max E . 10 s ec. Max.
2.5~5 C / sec.
2.5~5 o C / sec.
240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC
Pre-heating 120~150 oC
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
Lead F ree Solder Pre-heat Pre-heat time Peak-Tempera re tu Sold ering time Cond ition 150 200E ~ 120 sec. Max. 260 Max E . 10 s ec. Max.
1~5 o C / sec.
1~5 o C / sec.
260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC
Pre-heating 150~200 o C
120sec. Max.
(3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315C under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don't guarantee the products.
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Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
10. precaution for use
(1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5C ~30C Humidity : maximum 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40C Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 603/4 5C. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice.
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